1. 3D Laser Engraving Machine LE-MSE-Glass

    2. We used to adopt mechanical etching or CO2 laser engraving technologies to mark glass. However, these methods will probably scratch the surface of the glass and affect its strength and appearance. What’s worse, they may compromise the quality and impact usage.
      To solve the problem, we develop laser sub-marking technology. This technology can mark inside glass, which ensures a smooth and complete surface as well as a readable image.
      This marking process does not require tapes or sprays, so extra cleaning and post-processing is not needed.
      Our laser engraving machine LE-MSE-Glass can be applied for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries, etc.
      Technical Data of Laser Engraving Machine LE-MSE-Glass
      Laser system model LE-MSE-Glass
      Laser medium Diode pumped YVO4, 532 nm
      Pulse energy @ 2kHz 1 mj
      Stability +/- 2% (pulse to pulse)
      Beam quality M2<1.3
      Electrical connection 220V +/-10%; 10 Amp/phase
      Max power consumption 500 W
      Connecting cables 2 m for electric cables and 3 m I/O cable
      Typical features Laser Micro Sub-engraving System
      Marking Resolution 800 dpi
      Max marking range 50×50×3 mm
      Marking lens 1
      Max marking rate 2 KHz/s
      Cooling Entirely air cooling
      Other Dimensions (L × W× Hmm) Weight
      Sub marking system Open frame, 660×315×265 Approx 30 kg
      Painting Silver-black
      Documentation 1 x
      Operation demands: room temperature : 18-25℃ room humidity: <60%